Rigid-Flex
Rigid-Flex PCB :
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1.Layer : 4 Layer
2.material : FR4+PI 3.Copper foil : 1/2 oz 4.Board Thickness : 1.6mm 5.Solder Mask : Green 6.Coating : H.A.L.+ENIG |
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1.Layer : 12 Layer
2.material : FR4+PI 2+8+2 3.Copper foil : 1/2 oz 4.Board Thickness : 1.6mm 5.Solder Mask : Green 6.Coating : ENIG |
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1.Layer : 4 Layer
2.material : FR4+PI 3.Copper foil : 1/2 oz 4.Board Thickness : 1.6mm 5.Solder Mask : Green 6.Coating : ENIG |
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1.Layer : 4 Layer
2.material : FR4+PI 3.Copper foil : 1/2 oz 4.Board Thickness : 1.6mm 5.Solder Mask : Green 6.Coating : ENIG 7.TFT-LCD product |
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1.Product : Rigid & Flex Board
2.Material : PI D/S & FR4 Four Layers 3.Cu Type : RA Copper 4.Board Thickness : Total 1.6mm 5.Cover Layer : 25 / 25 µm 6.Surface Coating : I /G 7.Stiffener :PI 25 µm 8.Trace :5 / 5 mil |
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1.Product : Rigid & Flex Board
2.Material : PI D/S & FR4 Four Layers 3.Cu Type : RA Copper 4.Board Thickness :Total 1.6mm 5.Cover Layer : 25 / 25 µm 6.Surface Coating : HAL 7.Trace : 6 / 6 mil |