PCB Burn In Board :

• Material Polymide,Hi-TG,FR-4
• LayerCount 8~26 layers
• Thickness 1.6T
• Application Burn-in test equipment for semiconductor products.
• Test Condition -45¢XC [cool] + 175¢XC [hot]
• Using Conditions Burn-in temperature + 150¢XC Max
• Burn-in Voltage 20V Max
• Probe Card PCB to testan electrical character is tics of each chip on SEMICON Water
• LAyer 8L - 44L
• impedance 50Ω ¡Ó596
• Socket Board Board to test packaged chips on SEMICON Water
• Layer 6L - 26L
• impedance 50Ω ¡Ó596