PCB Burn In Board

PCB Burn In Board :


  • Material Polymide,Hi-TG,FR-4
  • LayerCount 8~26 layers
  • Thickness 1.6T
  • Application Burn-in test equipment for semiconductor products.
  • Test Condition -45XC [cool] + 175XC [hot]
  • Using Conditions Burn-in temperature + 150XC Max
  • Burn-in Voltage 20V Max
  • Probe Card PCB to testan electrical character is tics of each chip on SEMICON Water
  • LAyer 8L - 44L
  • impedance 50Ω 596
  • Socket Board Board to test packaged chips on SEMICON Water
  • Layer 6L - 26L
  • impedance 50Ω 596