PCB Burn In Board Capabilities
PCB Burn In Board Capabilities:
| Layer Count | Up to 12 layers .062" thicknes Up to 14 layers .067" thickness Up to 16 layers .093" thickness |
|---|---|
| Board Size | 12" x 24" and smaller 19" x 23" 23" x 27" |
| Materials | Nelco 4000-13 Polyimide 55ST Thermount 55 ST, 85 MT BT |
| Pitch | Min .5 mm |
| Imaging | Min Line/Space .003/.003 Surface Mt Pad .008 Layer to Layer Reg +-.002 |
| Lamination | Max Layers 30 Min/Max Thickness .002/.280 Overall Thickness +- 8% Bow & Twist .7% |
| Drill and Routing | Hole Location .004 Finished Hole Size .006 Tolerance (PTH) +-.001 inches Tolerance (NPTH) +-.001 inches Min Drill Size .006 Aspect Ratio 20:1 Min Pad to Hole (I/L) Finished Hole Size + .010 inches Min Plane Relief Finished Hole Size + .025 inches |
| Plating | Electroless Ni 100 micro inches Immersion Au 3 - 5 micro inches Copper .003 inches Nickel .0003 - .0005 inches Solder .0001-.001 inches Max Gold 50 - 100 micro inches |
| Etch Factors | Inner Layer + .0005 inches Outer Layer + .0005 inches Controlled Imp +-5% |
| Solder Mask | Min Clearance .002 /side Min Lay Down .002 inchesColor Most colors available |
| Nomenclature/ Legend | Min Line .005 inches Color White (other colors available on request) |