1.Product : Three Layer D/S
2.Material : PI 25 / 25 / 25 um 3.Cu Type : ED Copper 4.Board Thickness : Total 0.236 mm 5.Cover Layer : 25 / 25 µm 6.Surface Coating : HAL 7.Stiffener : FR4 1.5mm 8. Trace : 6 / 6 mil |
1.Product : Three Layer D/S
2.Material : PI 5 / 10 / 18µm 3.Cu Type : RA Copper 4.Board Thickness : Total 0.35 mm 5.Cover Layer : 25 / 35 µm 6.Surface Coating : HAL 7.Stiffener : PET 0.15mm 8.Trace : 6 / 6 mil |