Rigid-PCB Capabilities
Rigid PCB Capabilities:
| Min. trace width / space ( Inner / External ) | 3 / 3 mil | |
|---|---|---|
| Min. between SMD pad to be covered solder mask | 4mil | |
| Min. drill size for through hole (Mechanical drill) | 7.8 mil | |
| Aspect Ratio (Mechanical drill) | 6:1 | |
| Max. layer count | 24-L | |
| Max. working PNL size | 21" x 24" | 533.4 x 609.6 mm |
| Min. board overall thickness for 4-L 6-L 8-L 10-L | 0.35 mm 0.55 0.8 1.0 | |
| Max. board overall thickness for 4 - 16L | 250 mil | 6.35 mm |
| Min. thin core thickness | 4 mil | 0.1 mm |
| Min. SMT test pitch | 7 mil | |
| Registration tolerance Layer to layer Solder Mask | 4 mil 3 | 0.1 mm 0.075 |
| Min. hole location tolerance | 3 mil | 0.075 mm |
| Min. solder thickness on SMT Pads in different pitch | <= 25mil >= 50mil > 50mil | 120µ 100µ 80µ |
| Impedance control | 120, 100, 75, 65, 50, 45 Ω+- 10% | |
| Surface finish | HASL, OSP, Immersion Gold, Carbon Ink, Immersion Silver. | |