Aluminum-Base PCB Capabilities :

• Copper Layer : 35µm - 350µm (1 - 10 oz)
• Dielectric Layer : 0.114mm - 0.2mm
• Base Layer : 0.2mm - 4.0mm

Special Features :

• Min thickness : 0.2mm
• load-bearing : more than 2Kg
• heat dissipation : 10 times than FPC
• cost : Cheaper than FPC
• expanding : connect to FPC
• 

Dielectric Layer :

• Brand : ARLON (USA)
• Material : liquidity epoxy resin Polypropylene plastic
• heat conduction components : AL
• Thermal conductivity : 1.1 - 2w N/K
• Coefficient of thermal expansion : 17 PPM/K
• Operating Temperature : 180 - 250 Centigrade