Maximum Panel Size | 10" * 15.8"(250 mm * 400 mm) |
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Line width & Spacing | 4 mil |
Copper thickness | 1/3 oz |
Layer to Layer Registration | +- 5 mil |
Via/Drill Size | Minimum drill Hole Diameter : 10 mil Minimum Via Size : 8 mil |
Micro Via | 4 mil |
Surface Finish | Hard Gold / Immersion Gold / HASL / Immersion Silver / Immersion Tin / ENTEK |
Coverlayer | PI, Flexible Solder Mask |
Stiffener material | PI , FR4 and Metal |
Flex with Assembly (Through-hole and SMT) |