| Maximum Panel Size | 10" * 15.8"(250 mm * 400 mm) |
|---|---|
| Line width & Spacing | 4 mil |
| Copper thickness | 1/3 oz |
| Layer to Layer Registration | +- 5 mil |
| Via/Drill Size | Minimum drill Hole Diameter : 10 mil Minimum Via Size : 8 mil |
| Micro Via | 4 mil |
| Surface Finish | Hard Gold / Immersion Gold / HASL / Immersion Silver / Immersion Tin / ENTEK |
| Coverlayer | PI, Flexible Solder Mask |
| Stiffener material | PI , FR4 and Metal |
| Flex with Assembly (Through-hole and SMT) |